小螺距,小口距,细距;
Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology
细微间距器件焊点形态成形建模与预测
The Quality of Fine Pitch Ball Bonding: Influencing Factors& Solutions
高密度球键合质量的影响因素和解决方法
Ideal for fine pitch pattern because the laser resolution.
激光是超微细线路制作的理想工具.
The Study of Solder Bridge in Fine Pitch Devices
细间距器件焊点桥接研究
The stem has fine pitch to maximize mechanical advantage.
阀杆经过精心定位,能够最大限度发挥其机械优势.
There are serious challenges with fine pitch devices.
对于微节距元器件来说有着一系列的挑战.
Fatigue Life Prediction for Fine Pitch Device Soldered Joints Based on Creep Model
基于蠕变模型细间距器件焊点疲劳寿命预测
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